Solutions
Through-Glass Via (TGV) Solutions
Redefining the Future of Advanced Semiconductor Packaging
Driven by the surge in AI computing and high-performance chip demand, traditional organic substrates have reached their physical limits. Glass substrates, boasting superior flatness and excellent electrical insulation, have emerged as the premier choice for next-generation packaging. Laser Mech Taiwan offers mature Through-Glass Via (TGV) solutions. Utilizing ultra-fast laser precision modification technology, we empower clients to precisely execute high-density micro-via layouts with exceptional thermal management performance across complex packaging architectures.
CORE VALUE
The Perfect Synergy of High Throughput and Precision Engineering
Laser Modification & Selective Chemical Etching Technology
Utilizing ultrafast lasers to induce internal bulk modification in glass combined with selective chemical etching, this technique achieves high-aspect-ratio, crack-free micro-via machining without compromising structural integrity. It ensures sidewall surface quality that meets the most stringent semiconductor-grade standards.
Superior Electrical & Thermal Management Performance
TGV technology enables glass substrates to deliver exceptional high-frequency dielectric performance and ultra-high dimensional precision. This not only effectively addresses thermal management challenges in advanced packaging, but also establishes a more stable signal transmission path for AI chip carriers and high-frequency communication modules.
High-Throughput, Low-Cost Commercial Solution
Departing from traditional processes, our solution leverages optimized optical beam paths to dramatically boost processing throughput per unit time while effectively reducing the cost per via. Specially engineered for high-volume manufacturing, this field-proven solution enables you to swiftly capture first-mover advantages in the next-generation packaging market.
Action-Oriented Process Empowerment
Glass substrates are exceptionally sensitive to laser thermal energy, demanding profound optical tuning expertise. Laser Mech Taiwan empowers clients with deep-tier optical calibration, enabling full autonomous control over the interdependent process variables between laser modification and subsequent chemical etching.
APPLICATIONS
Semiconductor Advanced Packaging
High-density micro-via drilling for AI chip substrates (Glass Substrates) and advanced interposers.
Next-Generation Display Technologies
Precision processing for Micro-LED transparent substrates and advanced optoelectronic sensor packaging.
MEMS & Optical Communications
Precision laser structuring for microfluidic glass chips and high-frequency RF filter substrates.
An optimized, High-Efficiency Industrial Process
From laser processing and automation integration to optical measurement, we empower businesses to establish more stable, high-quality manufacturing solutions.